The development of low-loss capacitor material by ECC Labs has enabled embedded low-loss (RF) capacitors. The technology can replace discrete RF capacitors as well as integrated RF capacitors on wafers. This new dielectric material and stack-up allows designing multilayer RF capacitors into PCBs and substrates. The presentation will illustrate details of the material’s key characteristics, electronic performance, process handling, and application examples.

With the rapid development of artificial intelligence and autonomous driving technology, miniaturization, integration, and modularization are the general trend of electronic product design, especially in chip power supply. Designers are looking for higher efficiency, higher power density, better reliability, and smaller package sizes. The inductors of tertiary power modules that power CPUs and GPUs usually occupy a large surface area, making it challenging to deploy more chips and small-sized resistor and capacitors. Thanks to the development of copper-iron cofiring integrated inductor technology, inductors can be embedded into the PCB and copper plating makes connections and fanout. In some ways, it is the first packaging by PCB embedded technology, which can solve this problem well. This presentation focuses on the advantages of inductor embedded PCBs, key manufacturing technologies, reliability test, design rules, and typical product shows.

Traditionally ECAD users weren’t integrated or involved in the supply chain. With the rising challenges in semiconductor industry around chip shortages, however customers have realized the need for integrating ECAD with supply chains. Last time buy and purchasing decisions have moved upstream to ECAD designers. Learn how to validate design components and select components for your designs based on part availability, lifecycle status and most importantly lead time all from within the design tool. We will demonstrate how to make supply chain resilience an essential part of the design process.